Network Access Control PCB board Controller PCBA Board yeTerecommunication Indasitiri
Manufacturing info
Muenzaniso Nha. | PCB-A44 |
Gungano nzira | SMT |
Transport package | Anti-static Packaging |
Certification | UL, ISO9001&14001, SGS, RoHS, Ts16949 |
Tsanangudzo | IPC Kirasi2 |
Minimum Space/Mutsetse | 0.075mm/3mil |
Application | Kukurukurirana |
Origin | Yakagadzirwa muChina |
Kukwanisa Kugadzira | 720,000 M2/Gore |
Product Description
PCBA Projects Nhanganyaya
ABIS CIRCUITS Kambani inoendesa masevhisi, kwete zvigadzirwa chete.Isu tinopa mhinduro, kwete zvinhu chete.
Kubva pakugadzirwa kwePCB, zvikamu zvinotenga kune zvikamu zvinoungana.Zvinosanganisira:
- PCB Tsika
- PCB dhizaini / dhizaini zvinoenderana neyako schematic dhizaini
- PCB kugadzira
- Component sourcing
- PCB Unganidza
- PCBA 100% bvunzo
Zvatiri Zvakanakira
- Yepamusoro-yekupedzisira euipment-yakakwira yekumhanyisa Pick uye Nzvimbo Machina anogona kugadzirisa anenge zviuru makumi maviri neshanu zveSMD zvikamu paawa.
- Yakanyanya mashandiro ekupa kugona 60K Sqm pamwedzi-Inopa yakaderera vhoriyamu uye pane-inoda PCB kugadzirwa, zvakare yakakura-yakakura zvigadzirwa.
- Professional engineering timu-40 mainjiniya uye yavo yemidziyo imba, yakasimba paOEM.Inopa sarudzo mbiri dziri nyore: Tsika uye Yakajairwa-Yakadzama ruzivo rweIPC Kirasi II uye III Maitiro
Isu tinopa yakakwana yekutendeuka-kiyi EMS sevhisi kune vatengi vanoda kuti tiunganidze iyo PCB muPCBA, kusanganisira prototypes, NPI chirongwa, diki nepakati vhoriyamu.Isu tinokwanisawo kuwana zvese zvikamu zvePCB yako gungano chirongwa.Mainjiniya edu uye timu yekutsvagisa vane ruzivo rwakapfuma mukugovera keteni uye EMS indasitiri, ine ruzivo rwakadzama mumusangano weSMT unobvumira kugadzirisa nyaya dzese dzekugadzira.Sevhisi yedu inodhura-inoshanda, inochinjika, uye yakavimbika.Isu takagutsa vatengi mumaindasitiri mazhinji anosanganisira ekurapa, maindasitiri, emotokari uye emagetsi evatengi.
PCBA Kugona
1 | SMT musangano kusanganisira BGA gungano |
2 | Yakagamuchirwa SMD machipisi: 0204, BGA, QFP, QFN, TSOP |
3 | Kureba kwechikamu: 0.2-25mm |
4 | Min kurongedza: 0204 |
5 | Min kure pakati peBGA : 0.25-2.0mm |
6 | Min BGA saizi: 0.1-0.63mm |
7 | Min QFP nzvimbo: 0.35mm |
8 | Min gungano saizi: (X * Y): 50 * 30mm |
9 | Saizi yakakura yegungano: (X * Y): 350 * 550mm |
10 | Sarudza-nzvimbo chaiyo: ± 0.01mm |
11 | Kuisa kugona: 0805, 0603, 0402 |
12 | High pin count press fit inowanikwa |
13 | SMT huwandu pazuva: 80,000 mapoinzi |
Kugona - SMT
Mitsetse | 9(5 Yamaha,4KME) |
Capacity | 52 mamiriyoni ekuisa pamwedzi |
Max Board Saizi | 457*356mm.(18"X14") |
Min Component size | 0201-54 sq.mm.(0.084 sq.inch),chibatanidza chakareba,CSP,BGA,QFP |
Speed | 0.15 sec/chip,0.7 sec/QFP |
Kugona - PTH
Mitsetse | 2 |
Max board width | 400 mm |
Type | Dual wave |
Pbs chimiro | Kutungamira-isina mutsara rutsigiro |
Max temp | 399 degrees C |
Spray flux | add-on |
Pre-kupisa | 3 |
Quality Control
Kuedza kweAOI | Inotarisa kune solder pasteChecks yezvikamu kusvika ku0201 Cheki yezvikamu zvisipo, offset, zvisizvo zvikamu, polarity |
X-Ray Kuongorora | X-Ray inopa yakakwira-resolution yekuongorora ye:BGAs/Micro BGAs/Chip scale mapakeji/Bare boards |
In-Circuit Testing | In-Circuit Testing inowanzoshandiswa pamwe chete neAOI kuderedza kusashanda zvakanaka kunokonzerwa nezvinetso zvechikamu. |
Power-up Test | Yepamberi Basa TestFlash Chishandiso Chirongwa Kuedza kushanda |
- IOC iri kuuya yekuongorora
- SPI solder paste kuongorora
- Online AOI kuongorora
- SMT yekutanga chinyorwa chekuongorora
- Kuongorora kwekunze
- X-RAY-welding kuongorora
- BGA mudziyo rework
- QA kuongorora
- Anti-static warehousing uye kutumira
Chitupa
FAQ
Panguva yekuendesa chiyero chinodarika 95%
a), maawa makumi maviri nemana nekukurumidza kutendeuka kune mbiri mativi prototype PCB
b),48hours for 4-8 layers prototype PCB
c),1 awa yekotesheni
d), maawa maviri einjiniya mubvunzo / Chichemo mhinduro
e), 7-24 maawa ekutsigira kwehunyanzvi / kurongeka sevhisi / kugadzira mashandiro
A PCB ibhodhi rine makwara emhangura nemapadhi anobatanidza zvinhu zvemagetsi.PCBA inoreva kuunganidzwa kwezvikamu paPCB kugadzira mudziyo wemagetsi unoshanda.
Schekare paste chinoshandiswa kubata kwechinguva zvinhu zvemagetsi panzvimbo zvisati zvabatanidzwa zvachose kuPCB panguva yereflow soldering process.
Kukwanisa kugadzirwa kwezvinhu zvinopisa zvinotengeswa | |
Kaviri Side/Multilayer PCB Workshop | Aluminium PCB Workshop |
Unyanzvi Kugona | Unyanzvi Kugona |
Raw zvinhu: CEM-1, CEM-3, FR-4 (High TG), Rogers, TELFON | Raw zvinhu: Aluminium base, Copper base |
Layer: 1 layer kusvika ku20 Layers | Layer: 1 layer uye 2 Layers |
Min.line upamhi/nzvimbo: 3mil/3mil(0.075mm/0.075mm) | Min.line upamhi/nzvimbo: 4mil/4mil(0.1mm/0.1mm) |
Min.Hole saizi: 0.1mm(dirilling gomba) | Min.Gomba saizi: 12mil(0.3mm) |
Max.Saizi yebhodhi: 1200mm * 600mm | Max.Bhodhi saizi: 1200mm* 560mm(47in* 22in) |
Yakapedzwa bhodhi ukobvu: 0.2mm- 6.0mm | Yakapedzwa bhodhi ukobvu: 0.3 ~ 5mm |
Copper foil ukobvu: 18um ~ 280um (0.5oz ~ 8oz) | Copper foil ukobvu: 35um ~ 210um (1oz ~ 6oz) |
NPTH Gomba Kushivirira: +/-0.075mm, PTH gomba Kushivirira: +/-0.05mm | Gomba chinzvimbo kushivirira: +/-0.05mm |
Rondedzero Kushivirira: +/-0.13mm | Routing rondedzero kushivirira: +/ 0.15mm;kushivirira kwekutaura: +/ 0.1mm |
Surface yapera: Lead-isina HASL, kunyudzwa goridhe (ENIG), kunyudza sirivha, OSP, goridhe plating, goridhe chigunwe, Carbon INK. | Surface yapera: Tungamira yemahara HASL, kunyudza goridhe (ENIG), kunyudza sirivha, OSP nezvimwe |
Impedancing kudzora kushivirira: +/- 10% | Ramba ukobvu kushivirira: +/-0.1mm |
Kukwanisa kugadzira: 50,000 sqm / mwedzi | MC PCB Kugadzira kugona: 10,000 sqm / mwedzi |
Yedu Yemhando Yekusimbisa Matanho sezviri pazasi:
a), Visual Inspection
b),Flying probe, fixture tool
c), Impedance control
d), Solder-kugona kuona
e), Digital metallogric microscope
f),AOI(Automated Optical Inspection)
Bhiri rezvinhu (BOM) rinotsanangura:
a),Manufacturers zvikamu nhamba,
b),Cnhamba yezvikamu zvevashambadziri (semuenzaniso Digi-kiyi, Mouser, RS)
c), PCBA sampuli mapikicha kana zvichibvira.
d), Huwandu
ABIS haina MOQ zvinodiwa zvePCB kana PCBA.
Kukwanisa kugadzirwa kwezvinhu zvinopisa zvinotengeswa | |
Kaviri Side/Multilayer PCB Workshop | Aluminium PCB Workshop |
Unyanzvi Kugona | Unyanzvi Kugona |
Raw zvinhu: CEM-1, CEM-3, FR-4 (High TG), Rogers, TELFON | Raw zvinhu: Aluminium base, Copper base |
Layer: 1 layer kusvika ku20 Layers | Layer: 1 layer uye 2 Layers |
Min.line upamhi/nzvimbo: 3mil/3mil(0.075mm/0.075mm) | Min.line upamhi/nzvimbo: 4mil/4mil(0.1mm/0.1mm) |
Min.Hole saizi: 0.1mm(dirilling gomba) | Min.Gomba saizi: 12mil(0.3mm) |
Max.Saizi yebhodhi: 1200mm * 600mm | Max.Bhodhi saizi: 1200mm* 560mm(47in* 22in) |
Yakapedzwa bhodhi ukobvu: 0.2mm- 6.0mm | Yakapedzwa bhodhi ukobvu: 0.3 ~ 5mm |
Copper foil ukobvu: 18um ~ 280um (0.5oz ~ 8oz) | Copper foil ukobvu: 35um ~ 210um (1oz ~ 6oz) |
NPTH Gomba Kushivirira: +/-0.075mm, PTH gomba Kushivirira: +/-0.05mm | Gomba chinzvimbo kushivirira: +/-0.05mm |
Rondedzero Kushivirira: +/-0.13mm | Routing rondedzero kushivirira: +/ 0.15mm;kushivirira kwekutaura: +/ 0.1mm |
Surface yapera: Lead-isina HASL, kunyudzwa goridhe (ENIG), kunyudza sirivha, OSP, goridhe plating, goridhe chigunwe, Carbon INK. | Surface yapera: Tungamira yemahara HASL, kunyudza goridhe (ENIG), kunyudza sirivha, OSP nezvimwe |
Impedancing kudzora kushivirira: +/- 10% | Ramba ukobvu kushivirira: +/-0.1mm |
Kukwanisa kugadzira: 50,000 sqm / mwedzi | MC PCB Kugadzira kugona: 10,000 sqm / mwedzi |
·NeABIS, vatengi vanodzikisa zvakanyanya uye zvinobudirira mitengo yavo yekutenga zvinhu pasi rose.Kuseri kwesevhisi yega yega yakapihwa neABIS, yakavanzwa kuchengetedza-mutengo kune vatengi.
.Tine zvitoro zviviri pamwe chete, imwe ndeye prototype, kukurumidza kutendeuka, uye diki kugadzira vhoriyamu.Imwe yacho ndeyekugadzirwa kwakawanda zvakare yeHDI board, ine vashandi vane hunyanzvi hwepamusoro, yezvigadzirwa zvemhando yepamusoro nemitengo inokwikwidza uye nekuuya-nguva.
.Isu tinopa zvakanyanya hunyanzvi kutengesa, tekinoroji uye logistic rutsigiro, pasi rese nemaawa makumi maviri nemana ekunyunyuta mhinduro.