Mhando dzakasiyana dzekurongedza dzeSMDs

Zvinoenderana neiyo nzira yekusangana, zvinhu zvemagetsi zvinogona kukamurwa kuita kuburikidza-gomba zvikamu uye pamusoro pegomo components (SMC).Asi mukati meindasitiri,Surface Mount Devices (SMDs) rinoshandiswa zvakanyanya kutsanangura izvi pamusorochikamu zviri inoshandiswa mumagetsi ayo akaiswa zvakananga pamusoro pebhodhi rakadhindwa redunhu (PCB).MaSMD anouya mumhando dzakasiyana dzekurongedza, imwe neimwe yakagadzirirwa zvinangwa, zvipingamupinyi zvenzvimbo, uye zvinodiwa zvekugadzira.Heano mamwe marudzi akajairika eSMD kurongedza:

1. SMD Chip (Rectangular) Packages:

SOIC (Small Outline Integrated Circuit): Pasuru ine rectangular ine gull-wing inotungamira pamativi maviri, inokodzera maseketi akabatanidzwa.

SSOP (Shrink Diki Outline Package): Yakafanana neSOIC asi ine diki saizi yemuviri uye yakatsetseka.

TSSOP (Thin Shrink Diki Outline Package): Iyo yakatetepa vhezheni yeSSO.

QFP (Quad Flat Package): Sikweya kana rectangular package ine inotungamira kumativi mana.Inogona kuve yakaderera-mbiri (LQFP) kana yakanyanya kunaka-pitch (VQFP).

LGA (Land Grid Array): Hapana inotungamira;pachinzvimbo, mapedhi ekusangana anorongedzerwa mugidhi pazasi.

2. SMD Chip (Square) Packages:

CSP (Chip Scale Package): Yakanyanya compact ine solder mabhora akananga pamupendero wechikamu.Yakagadzirwa kuti ive padyo nehukuru hweiyo chaiyo chip.

BGA (Ball Grid Array): Solder mabhora akarongwa mugidhi pasi pepasuru, achipa yakanakisa kupisa uye magetsi kuita.

FBGA (Yakanaka-Pitch BGA): Yakafanana neBGA asi ine gomo rakatsetseka repamusoro pechikamu density.

3. SMD Diode uye Transistor Packages:

SOT (Small Outline Transistor): Diki package ye diode, transistors, uye zvimwe zvidiki discrete zvikamu.

SOD (Small Outline Diode): Yakafanana neSOT asi yakananga madhiodhi.

ITA (Diode Outline):  Akasiyana-siyana madiki mapakeji e diode uye zvimwe zvidiki zvikamu.

4.SMD Capacitor uye Resistor Packages:

0201, 0402, 0603, 0805, zvichingodaro.: Aya macode enhamba anomiririra hukuru hwechikamu mugumi chemirimita.Semuenzaniso, 0603 inoreva chikamu chinoyera 0.06 x 0.03 inches (1.6 x 0.8 mm).

5. Mamwe maSMD Packages:

PLCC (Plastiki Inotungamira Chip Carrier): Sikweya kana rectangular pasuru ine inotungamira kumativi mana, yakakodzera maIC uye zvimwe zvikamu.

TO252, TO263, nezvimwewo: Idzi ndidzo shanduro dzeSMD dzechinyakare kuburikidza-gomba chikamu mapakeji senge TO-220, TO-263, ine yakadzika pasi yekumisikidza pamusoro.

Imwe neimwe yemhando dzepasuru iyi ine zvayakanakira nezvayakaipira maererano nehukuru, nyore kuungana, kuita kwekupisa, maitiro emagetsi, uye mutengo.Sarudzo yeSMD package inoenderana nezvinhu zvakaita sebasa rechikamu, nzvimbo iripo yebhodhi, kugona kugadzira, uye zvinodikanwa zvekupisa.