4 Layers 2.0mm ukobvu uye1oz Copper Green Mask Yakadhindwa Circuit Assembly Board
Manufacturing info
| Muenzaniso Nha. | PCB-A41 |
| Transport package | Vacuum Packing |
| Certification | UL, ISO9001&ISO14001,RoHS |
| Tsanangudzo | IPC Kirasi2 |
| Minimum Space/Mutsetse | 0.075mm/3mil |
| Origin | Yakagadzirwa muChina |
| Kukwanisa Kugadzira | 720,000 M2/Gore |
| Application | Consumer Electronics |
Product Description
PCBA Projects Nhanganyaya
ABIS CIRCUITS Kambani inoendesa masevhisi, kwete zvigadzirwa chete.Isu tinopa mhinduro, kwete zvinhu chete.
Kubva pakugadzirwa kwePCB, zvikamu zvinotenga kune zvikamu zvinoungana.Zvinosanganisira:
PCB Tsika
PCB dhizaini / dhizaini zvinoenderana neyako schematic dhizaini
PCB kugadzira
Component sourcing
PCB Unganidza
PCBA 100% bvunzo
Zvatiri Zvakanakira
Yepamusoro-yekupedzisira midziyo-yakakwira yekumhanya Pick uye Nzvimbo Machina anogona kugadzirisa anenge zviuru makumi maviri neshanu zveSMD zvikamu paawa.
Yakanyanya mashandiro ekupa kugona 60K Sqm pamwedzi-Inopa yakaderera vhoriyamu uye pane-inoda PCB kugadzirwa, zvakare yakakura-yakakura zvigadzirwa.
Professional engineering timu-40 mainjiniya uye yavo yemidziyo imba, yakasimba paOEM.Inopa sarudzo mbiri dziri nyore: Tsika uye Yakajairwa-Yakadzama ruzivo rweIPC Kirasi II uye III Maitiro
Isu tinopa yakakwana yekutendeuka-kiyi EMS sevhisi kune vatengi vanoda kuti tiunganidze iyo PCB muPCBA, kusanganisira prototypes, NPI chirongwa, diki nepakati vhoriyamu.Isu tinokwanisawo kuwana zvese zvikamu zvePCB yako gungano chirongwa.Mainjiniya edu uye timu yekutsvagisa vane ruzivo rwakapfuma mukugovera keteni uye EMS indasitiri, ine ruzivo rwakadzama mumusangano weSMT unobvumira kugadzirisa nyaya dzese dzekugadzira.Sevhisi yedu inodhura-inoshanda, inochinjika, uye yakavimbika.Isu takagutsa vatengi mumaindasitiri mazhinji anosanganisira ekurapa, maindasitiri, emotokari uye emagetsi evatengi.
PCBA Kugona
| 1 | SMT musangano kusanganisira BGA gungano |
| 2 | Yakagamuchirwa SMD machipisi: 0204, BGA, QFP, QFN, TSOP |
| 3 | Kureba kwechikamu: 0.2-25mm |
| 4 | Min kurongedza: 0204 |
| 5 | Min kure pakati peBGA : 0.25-2.0mm |
| 6 | Min BGA saizi: 0.1-0.63mm |
| 7 | Min QFP nzvimbo: 0.35mm |
| 8 | Min gungano saizi: (X * Y): 50 * 30mm |
| 9 | Saizi yakakura yegungano: (X * Y): 350 * 550mm |
| 10 | Sarudza-nzvimbo chaiyo: ± 0.01mm |
| 11 | Kuisa kugona: 0805, 0603, 0402 |
| 12 | High pin count press fit inowanikwa |
| 13 | SMT huwandu pazuva: 80,000 mapoinzi |
Kugona - SMT
| Mitsetse | 9(5 Yamaha,4KME) |
| Capacity | 52 mamiriyoni ekuisa pamwedzi |
| Max Board Saizi | 457*356mm.(18"X14") |
| Min Component size | 0201-54 sq.mm.(0.084 sq.inch),chibatanidza chakareba,CSP,BGA,QFP |
| Speed | 0.15 sec/chip,0.7 sec/QFP |
Kugona - PTH
| Mitsetse | 2 |
| Max board width | 400 mm |
| Type | Dual wave |
| Pbs chimiro | Kutungamira-isina mutsara rutsigiro |
| Max temp | 399 degrees C |
| Spray flux | add-on |
| Pre-kupisa | 3 |
Nzira dzekugadzira
Kugamuchira Material → IQC → Stock → Material to SMT → SMT Line Inorodha → Solder Paste/Glue Printing → Chip Mount → Reflow → 100% Kuongorora Kwekuona → Kuzvionera Kuongorora Kwega (AOI) → SMT QC Sampling → SMT PTH → Material PTH Mutsara Kutakurwa → Yakaputirwa Neburi → Wave Soldering → Bata Kumusoro → 100% Kuongorora Kwekuona → PTH QC Sampling → In-Circuit Test (ICT) → Yekupedzisira Gungano → Functional Test (FCT) → Kurongedza → OQC Sampling → Kutumira
Quality Control
| Kuedza kweAOI | Checks for solder paste Inotarisa kune zvikamu kusvika ku0201 Cheki yezvikamu zvisipo, offset, zvisizvo zvikamu, polarity |
| X-Ray Kuongorora | X-Ray inopa yakakwirira-resolution yekuongorora ye: BGAs/Micro BGAs/Chip scale packages/Bare boards |
| In-Circuit Testing | In-Circuit Testing inowanzoshandiswa pamwe chete neAOI kuderedza kusashanda zvakanaka kunokonzerwa nezvinetso zvechikamu. |
| Power-up Test | Yepamberi Basa Muedzo Flash Device Programming Kuedza kushanda |
Chitupa
FAQ
| Category | Inokurumidza Kutungamira Nguva | Normal Lead Time |
| Kumativi maviri | 24hrs | 120hrs |
| 4 Layer | 48hrs | 172hrs |
| 6 Layer | 72hrs | 192hrs |
| 8 Layer | 96hrs | 212hrs |
| 10 Layer | 120hrs | 268hrs |
| 12 Layer | 120hrs | 280hrs |
| 14 Layer | 144hrs | 292hrs |
| 16-20 Zvikamu | Zvinoenderana nezvinodiwa chaizvo | |
| Pamusoro pe20 Layers | Zvinoenderana nezvinodiwa chaizvo | |
Bhiri rezvinhu (BOM) rinotsanangura:
a), Vagadziri zvikamu nhamba,
b), nhamba yezvikamu zvevanopa zvikamu (semuenzaniso Digi-kiyi, Mouser, RS)
c), PCBA sampuli mapikicha kana zvichibvira.
d), Huwandu
| Kukwanisa kugadzirwa kwezvinhu zvinopisa zvinotengeswa | |
| Kaviri Side/Multilayer PCB Workshop | Aluminium PCB Workshop |
| Unyanzvi Kugona | Unyanzvi Kugona |
| Raw zvinhu: CEM-1, CEM-3, FR-4 (High TG), Rogers, TELFON | Raw zvinhu: Aluminium base, Copper base |
| Layer: 1 layer kusvika ku20 Layers | Layer: 1 layer uye 2 Layers |
| Min.line upamhi/nzvimbo: 3mil/3mil(0.075mm/0.075mm) | Min.line upamhi/nzvimbo: 4mil/4mil(0.1mm/0.1mm) |
| Min.Hole saizi: 0.1mm(dirilling gomba) | Min.Gomba saizi: 12mil(0.3mm) |
| Max.Saizi yebhodhi: 1200mm * 600mm | Max.Bhodhi saizi: 1200mm* 560mm(47in* 22in) |
| Yakapedzwa bhodhi ukobvu: 0.2mm- 6.0mm | Yakapedzwa bhodhi ukobvu: 0.3 ~ 5mm |
| Copper foil ukobvu: 18um ~ 280um (0.5oz ~ 8oz) | Copper foil ukobvu: 35um ~ 210um (1oz ~ 6oz) |
| NPTH Gomba Kushivirira: +/-0.075mm, PTH gomba Kushivirira: +/-0.05mm | Gomba chinzvimbo kushivirira: +/-0.05mm |
| Rondedzero Kushivirira: +/-0.13mm | Routing rondedzero kushivirira: +/ 0.15mm;kushivirira kwekutaura: +/ 0.1mm |
| Surface yapera: Lead-isina HASL, kunyudzwa goridhe (ENIG), kunyudza sirivha, OSP, goridhe plating, goridhe chigunwe, Carbon INK. | Surface yapera: Tungamira yemahara HASL, kunyudza goridhe (ENIG), kunyudza sirivha, OSP nezvimwe |
| Impedancing kudzora kushivirira: +/- 10% | Ramba ukobvu kushivirira: +/-0.1mm |
| Kukwanisa kugadzira: 50,000 sqm / mwedzi | MC PCB Kugadzira kugona: 10,000 sqm / mwedzi |
Aiwa, hatigonibvumamafaira emifananidzo, kana iwe usinaGerberfaira, unogona kutitumira sampuli kuti tikope.
PCB&PCBA Copy process:
Yedu Yekusimbisa Hunhu Matanho senge pazasi:
a), Visual Inspection
b), Kubhururuka kuferefeta, chishandiso chekugadzirisa
c), Impedance control
d), Solder-kugona kuona
e), Digital metallogric microscope
f), AOI (Otomatiki Optical Inspection)
ABlS inoita 100% yekuona uye kuongorora kweAOl pamwe nekuita kuyedza magetsi, kukwira kwemagetsi kuyedza, impedance control test, micro-sectioning, thermal shock test, solder test, kuvimbika kuyedzwa, insulating kuramba kuyedza, ionic kuchena kuyedzwa uye PCBA Functional bvunzo.
ABIS's Main Industries: Industrial Control, Telecommunication, Automotive Products uye Medical.Musika Mukuru weABIS: 90% International Market (40% -50% yeU.SA, 35% yeEurope, 5% yeRussia uye 5% -10% yeEast Asia) uye 10% Domestic Market.
Panguva yekuendesa chiyero chinodarika 95%
a), maawa makumi maviri nemana nekukurumidza kutendeuka kune mbiri mativi prototype PCB
b), maawa 48 e4-8 akaturikidzana prototype PCB
c), 1 awa yekotesheni
d), maawa maviri einjiniya mubvunzo / Chichemo mhinduro
e), 7-24 maawa ekutsigira kwehunyanzvi / kurongeka sevhisi / kugadzira mashandiro
·NeABIS, vatengi vanodzikisa zvakanyanya uye zvinobudirira mitengo yavo yekutenga zvinhu pasi rose.Kuseri kwesevhisi yega yega yakapihwa neABIS, yakavanzwa kuchengetedza-mutengo kune vatengi.
.Tine zvitoro zviviri pamwe chete, imwe ndeye prototype, kukurumidza kutendeuka, uye diki kugadzira vhoriyamu.Imwe yacho ndeyekugadzirwa kwakawanda zvakare yeHDI board, ine vashandi vane hunyanzvi hwepamusoro, yezvigadzirwa zvemhando yepamusoro nemitengo inokwikwidza uye nekuuya-nguva.
.Isu tinopa zvakanyanya hunyanzvi kutengesa, tekinoroji uye logistic rutsigiro, pasi rese nemaawa makumi maviri nemana ekunyunyuta mhinduro.
